From advanced TQFN, FBGA(CSP), PBGA, stacked die and flex tape products for the cell phone market, to high end STBGA, 12°± wafers handling capability and Flip Chip products for networking applications, innovation will continue to be at the heart of Signetics.
Signetics is also moving aggressively into new specialized markets, such as finger print sensors, CMOS image sensors, and modules that will add value to our customers’ bottom line.
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Call eComp today and let us help you with the Signetics components you need. Call us at 508-881-8399 or 1-877-463-2667 or email us now.