For over 50 years, the world of electronics has been revolutionized by continuous miniaturization, packing more power into ever-smaller spaces. Today, there is still a need for legacy components however these legacy components often need to be redesigned into compact form factors for modern applications.
eComp/Monzite have the ability to create or redesign Application Specific Multi Chip Modules into various packages. Learn more about our capabilities below!
Design to Specification
Electrical Testing and Environmental Screening
Analog Interface
Power Management PMIC
Linear RF & Microwave
Analog Switches Solid State Relays Drivers Level ShiftersSensor and Detectors Amplifiers Multipliers Dividers Voltage Regulators Charge Pumps DC DC Converters
Load Drivers RF Switches RF Attenuators
RF Phase Shifters RF Switch Drivers
Application Specific Multi Chip Module
Functional Blocks in QFN DFN DIP packaging
2 x 2 mm – 15 x 15 mm size
.5 mm to 2mm pitch
Highly integrated SMT Chip
Scale Package
Ex 27 parts in 4 x 4 mm QFN
