eComp offers sourcing for obsolete and legacy component solutions. Counterfeit Electronic Parts Avoidance is a must in today’s electronic component market. eComp complies with all AS6081 Compliant testing requirements.
In-House Capabilities |
Required Tests Per AS6081 Compliant for Counterfeit Detection Services |
|---|---|
| ✓ | • Documentation & Visual Inspection |
| ✓ | • Remarking & Resurfacing Detection |
| ✓ | • Lead Analysis – EDX (Energy Dispersive X-Ray) |
| ✓ | • X-Ray |
| ✓ | • Decapsulation |
Additional Test Services Offered by eComp |
|
| ✓ | • SEM & Surface Analysis |
| ✓ | • Cross Section |
| • Electrical Test, Burn-In, SAM, Tinning (VAS) | |
| • Hermeticity Verifications (Fine & Gross Leak) (VAS) | |
| • Solderability Test, Thermal Cycling (VAS) | |
| Technical Staff available to provide “Testing / Remanufactured Solutions” | |
AS6081 Compliant – Counterfeit Electronic Parts; Avoidance Protocol, Distributors
• prescribes counterfeit parts avoidance requirements directly applicable to distributors
• establish and maintain certified distributors of electronic components whose regular use of anti-counterfeit process controls and requirements (in their purchasing and supplying operations) is designed to ensure delivery of authentic products that meet original component manufacturer specifications.
• independent verification of conformance to this standard will be by third-party certification bodies (CBs). Accreditation of the CB will be through a recognized and respected accreditation body to ensure the impartiality and competence of the CB.
SAE AS6081 Compliant Requirements
QMS & Counterfeit Parts Control Plan:
• develop and implement a quality management system
• develop and implement a counterfeit electronic parts control plan that documents its processes used for risk mitigation, disposition, and reporting of counterfeit parts
Counterfeit Parts Control Plan: Purchasing Information & Supply Chain Traceability
• specify contract/purchase order quality requirements, including the flow down of applicable requirements of this document
• The documented processes shall require traceability to the OCM If unavailable, the customer shall be notified
Counterfeit Parts Control Plan:Verification of Purchased Product
• Specify test and inspection methodsfor the detection of counterfeit parts. Results of each inspection and test performed shall be documented, retained, and traceable to product information.
Counterfeit Electronic Parts Avoidance
| Test/Inspection | Minimum Sample Size | Level | |
|---|---|---|---|
| Lot Size 200 or greater Devices | Lot Size 1-99 devices | ||
| Minimum Required Tests | Level A | ||
| Documentation and Packaging (non-destructive) | A1 | ||
| Documentation and Packaging Inspection (4.2.6.2.1) | All devices | All devices | |
| External Visual Inspection (non-destructive) | A2 | ||
| a. General (4.2.6.2.2.1) | All devices | All devices | |
| b. Detailed (4.2.6.2.2.2) | 119 devices | 119 devices or all devices, whichever is less | |
| Remarking & Resurfacing (destructive) | A3 | ||
| Scanning Electron Microscope (4.2.6.2.3 A) | 3 devices | 3 devices | |
| Solvent Test for Remarking (4.2.6.2.3 B) | 3 devices | 3 devices | |
| Solvent Test for Resurfacing (4.2.6.2.3 C) | 3 devices | 3 devices | |
| Radiological (X-Ray) Inspection (non-destructive) | A4 | ||
| X-Ray Inspection (4.2.6.2.4) | 45 devices | 45 devices or all devices, whichever is less | |
| Lead Finish Evaluation (XRF (non-destructive) or EDS/EDX (destructive)) | A5 | ||
| XRF or EDS/EDX (4.2.6.2.5) (Appendix D.1) | 3 devices | 3 devices | |
| Delid/Decapsulation Physical Analysis (destructive) | A5 | ||
| Delid/Decapsulation (4.2.6.2.6) | 3 devices | 3 devices | |
| Additional Tests (as agreed between Customer and Organization | |||
| Thermal Testing | Level B | ||
| Thermal Cycling Test (Appendix D.2) | All devices | All devices | |
| Electrical Testing | Level C | ||
| Electrical Testing (Appendix D.3) | 116 devices | All devices | |
| Burn-In | Level D | ||
| Burn-In (Pre & Post) (Appendix D.4) | 45 devices | 45 devices or all devices, whichever is less | |
| Hermeticity Verification (Fine and Gross Leak) | Level E | ||
| Hermeticity Verification (Fine and Gross Leak) (Appendix D.5) | All devices | All devices | |
| Scanning Acoustic Microscopy (SAM) | Level F | ||
| Scanning Acoustic Microscopy (SAM) (Appendix D.6) | As specified | As specified | |
| Destructive Physical Analysis (DPA) | Level G | ||
| Destructive Physical Analysis (Appendix D.7) | As specified | As specified | |
| Other | Level H | ||
| Other test/inspections | As specified | As specified | |
eComp can help you with AS6081 Compliant – Counterfeit Electronic Parts Avoidance Protocol.
Call us at 508-881-8399 or 1-877-463-2667 or email us now.
