When baking components, they are heated at a temperature specified by the manufacturer to eliminate moisture that can damage components when in use.
After, device(s) are packaged in ESD-safe MSL bag along with desiccant and a humidity indicator card then vacuum sealed to keep moisture away from components in storage and transport.
Benefits
• Baking dissipates moisture inside components at a safe pace.
• Dry packing maintains the dry condition of devices.
• Helps prevent cracks in component packages or internal damage caused by moisture during assembly.
