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You are here: Home / Eltek Semiconductors ltd

Eltek Semiconductors ltd

Eltek SemiconductorseComp works closely with Eltek Semiconductors to procure and process semiconductor components in wafer, die and packaged form.

Die Supply
High quality semiconductor die for hybrid and chip on board applications.

Eltek is Europe’s longest established, franchised die processor. We supply high quality semiconductor die for use in hybrid and chip on board applications. Our traceable, controlled and certified stock of die exceeds nine million units with product from most major semiconductor manufacturers.

Quality levels:
– Commercial
– Military
– Space

Shipping formats:
– Waffle tray / Gel-Pak®
– Tape and Reel / Surftape®
– Sawn wafers

Visual inspection to:
– MIL-STD-883 Method 2010 Cond A or B
– MIL-STD-750 Method 2072 or 2073

Optional lot qualification to:
– MIL-STD 883
– MIL-PRF-38534
– Customer specification

Assembled Products
Cost effective packaging service, for industry-standard and custom configurations.

Eltek provides a complete, medium and low volume hermetic assembly, test and screening capability. We support a wide variety of ceramic packaging and TO cans intended for demanding environments with products ranging from diodes and transistors to microprocessors and memory.

Ceramic packaging styles
– Dual In-Line (DIL)
– Leadless Chip Carrier (LCC)
– J-Leaded Chip Carrier (JLCC)
– Flatpack and Cerquad (CQFP)
– Pin Grid Array (PGA)
– Custom Package configurations

Metal Can
– TO-39
– TO-5
– TO-18
– TO-99

Plastic and other packaging styles
– Available through approved sub-contractors

Test capability
– Discrete components, op-amps, regulators, precision analogue
– ADCs, mixed signal, ASIC, logic and all memory types
– Full range of AC/DC parametric and functional tests
– -65/200 deg.C temperature station

Test and screening
– MIL-STD 883, military and space flows
– Source Control Drawing
– Customer specification
– Manufacturers datasheet

Wafer Contract Processing
Automated wafer probe, saw and die sort. Bare die tape and reel service.

Eltek has a comprehensive range of sub-contract processing services which are capable of handling very high volume and fast turnaround requirements. Our specialist knowledge and equipment provides a cost effective service for all die users.

Wafer Probing
– Ambient to 200 deg.C
– Automatic Electroglas probers
– Actel approved FPGA wafer programming
– Mixed signal, digital, memory, discretes

Wafer Sawing
– Up to 8 inch / 200mm
– Automatic handling
– Single or part wafer flexibility

Die offload to waffle / chip tray
– Anti-static and conductive
– Die orientation
– Automatic and manual handling
– Gel-Pak®

Bare die tape and reel
– 8mm to 24mm widths
– Die sizes 0.25mm to 10mm
– 7 inch to 13 inch reels
– EIA/IS747
– Surftape® from Tempo Electronics

Visual inspection to:
– MIL-STD-883 Method 2010 Cond A or B
– MIL-STD-750 Method 2072 or 2073

Optional lot qualification to:
– MIL-STD 883
– MIL-PRF-38534
– Customer specification

Call eComp today and let us help you with Eltek Semiconductors. Call us at 508-881-8399 or 1-877-463-2667 or email us now.

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    Company Profile

    eComp™ is a specialty distributor and authenticator of products for the military, aerospace, medical and industrial marketplace. We provide authenticity verification / value added services for legacy components and can offer engineering assistance and custom replacement solutions for obsolete products and systems.

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    eComp™
    Electronic Components, Inc.

    39 Loring Dr
    Framingham, MA 01702

    Toll-Free 1-877-463-2667
    Tel: 508-881-8399

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