Solderability testing is a destructive process that tests the solderability of device leads. Steam aging is used with a combination of time (8h), temperature, and of course steam exposure to simulate lead aging of about 10 years.
At the end of the test a minimum of 95% of solder must adhere to each lead for the lot or batch to pass (MIL-STD-883). The point of this test is to make sure solder will stay properly adhered to leads in assembly and storage.
Ensure your device leads are solder and storage ready with eComp! Call us at 508-881-8399 or 1-877-463-2667 or email us now.
