Building a complex component or subsystem that performs flawlessly in extreme conditions requires a manufacturing partner you can trust, one with vision and creativity. eComp partnered with Monzite because they have a commitment to quality and development that is unmatched due to their inherent understanding of the intricate challenges that arise when contract manufacturing in demanding, regulated markets.
eComp and Monzite work closely together to improve your product development and production processes by helping you design, manufacture and test your products. If you are in the Defense, Aerospace, Industrial, Scientific or Medical market, let eComp and Monzite leverage their capabilities to help you solve your difficult engineering challenges.
Manufacturing Services: Consigned and Turnkey
- Die attach (eutectic solder and epoxy), board mount, wire bond (Au & Al 1mil to 20 mil) soldering and rework
- SMT, BGA, and Micro BGA, (re-balling) thru-hole, flex circuits
- Ribbon round, cable solder crimp and soldered connectors
- Environmental Screening
- Leak check (fine and gross) burn-in acceleration, temperature cycling, vacuum back
- Metal Work
- Welding (laser and resistance seam), milling, turning, painting, marking
Process and Design Support
Monzite will apply their deep understanding of the design process to solve difficult engineering challenges. Their engineering team is particularly strong in analog drivers, signal conditioning, linearizing and DC converters as well as RF, microwave and millimeter wave micro-strip components, regulators and subsystems. Monzite works mechanical design of housings, plating and hermetic packaging and will provide effective design for manufacturability (DFM), statistical process controls (SPC) and documentation services.
Monzite designs testing platforms and methodologies. Some of the tests offered by Monzite are as follows:
- Flying Probe/Functional
- Analog Time Based
- RF, microwave, millimeter wave
- Vector Network Measurements
- Scalar measurements
- Spectrum Analysis
- Noise Characterization
- High Power
Standard Subcomponents – Impellimax
Established in 1986, Impellimax has been a leader in the design of and manufacturing of PIN Diode, GaAs, GaN and SiC drivers, linearizers , hybrids and other subcomponents for almost 30 years. In 2013, Impellimax joined forces with Monzite’s founders in order to focus their talents on new product design and testing.
For a list of Obsolete product offerings available through eComp and Monzite click here!
Contact eComp today for a quote or catalog of available Monzite/Impellimax products and solve tomorrow’s engineering problems TODAY. Toll-Free 1-877-463-2667 or click here to contact us.